{"id":4198,"date":"2026-02-09T15:09:56","date_gmt":"2026-02-09T07:09:56","guid":{"rendered":"https:\/\/laserdiode-ld.com\/?p=4198"},"modified":"2026-01-26T13:22:40","modified_gmt":"2026-01-26T05:22:40","slug":"high-brightness-engineering-of-high-power-multimode-fiber-coupled-laser-diodes","status":"publish","type":"post","link":"https:\/\/laserdiode-ld.com\/ko\/high-brightness-engineering-of-high-power-multimode-fiber-coupled-laser-diodes.html","title":{"rendered":"\uace0\ucd9c\ub825 \uba40\ud2f0\ubaa8\ub4dc \uad11\uc12c\uc720 \uacb0\ud569 \ub808\uc774\uc800 \ub2e4\uc774\uc624\ub4dc\uc758 \uace0\ud718\ub3c4 \uc5d4\uc9c0\ub2c8\uc5b4\ub9c1"},"content":{"rendered":"

The Radiance Evolution: Defining Power in High-Output Diode Systems<\/h2>\n\n\n\n

In the industrial photonics sector, the move toward higher power density is the defining challenge of the decade. While single-mode diodes excel in spatial coherence, the high power fiber coupled laser diode<\/strong> is the engine of the industry, driving applications from fiber laser pumping to direct material processing and high-energy medical aesthetics. When we discuss wavelengths like 808nm, 915nm, or 940nm, we are operating in a regime where raw wattage must be balanced with “Brightness”\u2014the measure of how much power can be squeezed into a specific fiber core diameter and numerical aperture (NA).<\/p>\n\n\n\n

Brightness is technically defined as the power per unit area per unit solid angle. For a manufacturer, increasing the power of a 915nm \uad11\uc12c\uc720 \uacb0\ud569 \ub808\uc774\uc800<\/a><\/strong> is relatively simple; one can add more emitters. However, maintaining the brightness so that the light remains useful for a downstream fiber laser is an exercise in optical conservation. Every optical surface, every lens alignment, and every thermal gradient threatens to “blur” the beam, increasing its Beam Parameter Product (BPP) and reducing its utility. To understand the cost-to-performance ratio of these modules, we must look past the wattage on the datasheet and examine the engineering of the optical path and the semiconductor facet.<\/p>\n\n\n\n

Semiconductor Physics: The Thermal Bottleneck and Facet Protection<\/h2>\n\n\n\n

The journey of a high-power photon begins in the active region of a broad-area laser (BAL) chip. For a 808nm \ub808\uc774\uc800 \ub2e4\uc774\uc624\ub4dc<\/strong> \ub610\ub294 940nm \ub808\uc774\uc800 \ub2e4\uc774\uc624\ub4dc<\/a><\/strong>, the AlGaAs\/GaAs material system is typically used. The primary limit to power scaling in these chips is not the injection current itself, but the heat generated at the p-n junction and the fragility of the output facet.<\/p>\n\n\n

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\"\"<\/figure>\n<\/div>\n\n\n

Catastrophic Optical Mirror Damage (COMD) and Passivation<\/h3>\n\n\n\n

As the power density at the laser facet reaches several megawatts per square centimeter, the semiconductor material begins to absorb its own light. This absorption leads to localized heating, which shrinks the bandgap, leading to more absorption. This thermal runaway results in COMD\u2014a physical melting of the laser mirror. Professional-grade high-power diodes utilize Non-Absorbing Mirror (NAM) technology or specialized facet passivation layers (such as AlN or SiN) deposited in ultra-high vacuum environments. By moving the recombination of carriers away from the surface, we can drive a 940 nm \ub808\uc774\uc800 \ub2e4\uc774\uc624\ub4dc<\/a><\/strong> to higher current densities without the risk of sudden death.<\/p>\n\n\n\n

Thermal Resistance and Submount Materials<\/h3>\n\n\n\n

Heat is the primary factor in wavelength drift and power degradation. A standard high-power chip may convert 50% to 60% of electrical energy into light; the remaining 40% is heat that must be removed from a footprint smaller than a grain of salt. The thermal resistance ($R_{th}$) of the submount is critical. Engineers often choose Aluminum Nitride (AlN) or even Synthetic Diamond for submounts due to their high thermal conductivity and Coefficient of Thermal Expansion (CTE) matching with GaAs. If the CTE is mismatched, thermal cycling during operation will introduce mechanical strain into the crystal lattice, creating “Dark Line Defects” (DLDs) that slowly dim the laser over thousands of hours.<\/p>\n\n\n\n

Optical Architecture: Multi-Single Emitter vs. Laser Bars<\/h2>\n\n\n\n

In the design of a \uace0\ucd9c\ub825 \uad11\uc12c\uc720 \uacb0\ud569 \ub808\uc774\uc800 \ub2e4\uc774\uc624\ub4dc<\/a><\/strong> module, there are two primary schools of thought: the “Diode Bar” and the “Multi-Single Emitter” (MSE) architecture.<\/p>\n\n\n\n

The Problem with “Smile” in Laser Bars<\/h3>\n\n\n\n

A laser bar consists of multiple emitters grown on a single substrate. While they offer high power in a compact package, they suffer from a mechanical phenomenon known as “Smile.” During the soldering process, the bar may slightly bow (often by only 1-2 micrometers). This curvature makes it impossible to collimated all emitters into a single fiber simultaneously, as each emitter’s fast axis is at a slightly different height. This leads to a degraded BPP and lower coupling efficiency.<\/p>\n\n\n\n

Multi-Single Emitter (MSE) Combining<\/h3>\n\n\n\n

Most modern 915nm fiber coupled laser<\/strong> modules for fiber laser pumping now use MSE architecture. In this setup, individual laser chips are mounted on separate heat sinks and their beams are combined spatially or through polarization.<\/p>\n\n\n\n

    \n
  1. \uace0\uc18d \ucd95 \ucf5c\ub9ac\uba54\uc774\uc158(FAC):<\/strong> Each chip gets its own dedicated microlens. Since each chip is aligned independently, the “Smile” effect is eliminated.<\/li>\n\n\n\n
  2. Beam Transformation Systems (BTS):<\/strong> Because the emitters are “wide” (e.g., 100-200 micrometers), their beam quality in the slow axis is poor. A BTS lens rotates the individual beams by 90 degrees, allowing the “good” beam quality of the fast axis to be balanced with the “poor” quality of the slow axis, resulting in a more symmetric beam that fits more easily into a circular fiber core.<\/li>\n\n\n\n
  3. Spatial Combining:<\/strong> The beams are “stepped” or “stacked” using micro-prisms or mirrors before being focused into the fiber.<\/li>\n<\/ol>\n\n\n\n

    Fiber Coupling: The Law of Etendue and NA Management<\/h2>\n\n\n\n

    Coupling 200W of power into a 105-micrometer fiber with an NA of 0.22 requires strict adherence to the Law of Etendue. The product of the source size and its divergence angle cannot be reduced by any passive optical system. Therefore, the “bottleneck” is always the entry point of the fiber.<\/p>\n\n\n\n

    Numerical Aperture (NA) Filling<\/h3>\n\n\n\n

    A common mistake in cheaper modules is over-filling the fiber’s NA. While a module might claim to be 0.22 NA, if 95% of the power is concentrated in 0.15 NA, it is a much higher-quality “bright” source than one where the light is spread right to the edge of the 0.22 limit. Light at the very edge of the NA is more likely to escape the core and enter the cladding, especially if the fiber is bent. This “Cladding Power” can melt the fiber jacket or destroy the downstream laser system. High-end high power fiber coupled laser diode<\/strong> modules incorporate “Cladding Power Strippers” or internal baffles to ensure that only the light within the safe NA range leaves the module.<\/p>\n\n\n\n

    Reliability and Engineering for the Long-Tail<\/h2>\n\n\n\n

    The true value of a 808nm \ub808\uc774\uc800 \ub2e4\uc774\uc624\ub4dc<\/strong> is found in its “Bathtub Curve” performance\u2014minimizing infant mortality through burn-in and extending the “wear-out” phase through material science.<\/p>\n\n\n\n

    AuSn Hard Solder vs. Indium Soft Solder<\/h3>\n\n\n\n

    Historically, Indium solder was used for its flexibility, but it is prone to “Indium Migration,” where the solder physically moves and shorts out the diode over time. Modern high-reliability modules use Gold-Tin (AuSn) hard solder. While harder to process, AuSn provides a much more stable thermal and mechanical interface, which is vital for the 50,000+ hour lifespans required in industrial manufacturing environments.<\/p>\n\n\n\n

    Case Study: 915nm Pumping for a 2kW CW Fiber Laser<\/h2>\n\n\n\n

    \uace0\uac1d \ubc30\uacbd:<\/p>\n\n\n\n

    An industrial laser manufacturer specializing in sheet metal cutting systems. They were developing a 2kW Continuous Wave (CW) fiber laser and needed reliable pump sources.<\/p>\n\n\n\n

    \uae30\uc220\uc801 \uacfc\uc81c:<\/p>\n\n\n\n

    The customer was experiencing “Pump Failure” in their prototypes. Investigation revealed that the back-reflections from the fiber laser’s active core were re-entering the pump diodes, causing the 915nm chips to overheat and fail. Additionally, the BPP of their previous pumps was too high, forcing them to use 200um fibers, which reduced the overall efficiency of the fiber laser.<\/p>\n\n\n\n

    \uae30\uc220 \ub9e4\uac1c\ubcc0\uc218 \ubc0f \uc124\uc815:<\/strong><\/p>\n\n\n\n